SiP和SoC之间的区别

1.系统级封装(SiP)：
SIP代表“打包中的系统”。为了易于集成到系统中，这种类型的技术是很好的。它专为需要功能齐全，高度专业化的模块的多种高级包装应用而设计。在SiP中，多个集成电路封装在单个封装或模块中。

集成电路可以垂直地堆叠在基板上，并且两个或更多个IC被捆绑在单个封装内。它执行电子系统的大多数功能，通常在智能手机，数字音乐播放器等内部使用。由于将多个功能芯片(包括处理器和内存)集成到一个封装中，因此被视为功能封装。

2.片上系统(SoC)：
SoC代表片上系统。 SoC是一个定义不明确的术语，它是一个单芯片，可以完成过去占用多个芯片的所有工作。 SoC是CPU，微控制器，DSP，其他加速器或支持硬件中的一个或多个的封装，并且更具体地说，它没有关于应包含哪种类型的电路的特定标准。它适用于具有更高要求和更复杂要求的应用程序。 SoC中可能有许多微控制器。

它更像是单个芯片上的完整计算机系统，能够执行对资源有更高要求的复杂任务。有时缩写为SoC或SOC。

SiP和SoC之间的区别：

S.No.	SiP	SoC
01.	SiP refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators and multi functional chips into a single package.	SoC refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators or supporting hardware into a single chip.
02.	Performance benefit is more in a System in Package.	Performance benefit is less in a System on Chip as compared to SiP.
03.	Product volume is more than SoC.	Product volume is less than SiP.
04.	It includes logic, memory and possibly analog or RF functions.	It includes a computer engine micro processor core, digital signal processor core or graphics core memory and logic on a single chip.
05.	Performance (Clock speed) is less than that of SoC.	Performance (Clock speed) is higher than that of SiP.
06.	SiP takes less time to market it.	SoC takes more time time to market it.
07.	System design flexibility of SiP is very high.	System design flexibility of SoC is very low.
08.	SiP has good IP availability chances.	SoC has not so good IP availability chances.
09.	Passive device integration is medium.	Passive device integration is small.
10.	It typically used inside smart phones, digital music player etc.	It typically used in mobile computing such as tablets, smartphones, smartwatches and netbooks as well as embedded systems.