SiP 和 SoC 的区别

1. 系统级封装 (SiP)：
SIP 代表系统封装。为了轻松集成到系统中，这种类型的技术很好。它专为需要全功能、高度专业化模块的多种高级封装应用而设计。在 SiP 中，多个集成电路封装在单个封装或模块中。

集成电路可以垂直堆叠在基板上，并且两个或更多个 IC 被捆绑在单个封装内。它执行电子系统的大部分功能，通常用于智能手机、数字音乐播放器等。它被认为是一个功能包，因为它将多个功能芯片(包括处理器和内存)集成到一个包中。

2. 片上系统(SoC)：
SoC 代表片上系统。 SoC 是一个不太明确的术语。它是一个单一的芯片，它完成了过去占用多个芯片的所有工作。 SoC 是一个或多个 CPU、微控制器、DSP、其他加速器或支持硬件的封装，更具体地说，它没有关于它应该包含什么类型的电路的特定标准。它适用于具有更多要求和更复杂的应用程序。 SoC 中可能有许多微控制器。

它更像是一个完整的单芯片计算机系统，能够执行具有更高资源需求的复杂任务。有时缩写为 SoC 或 SOC。

SiP和SoC的区别：

S.No.	SiP	SoC
01.	SiP refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators and multi functional chips into a single package.	SoC refers to encapsulation of one or more of CPUs, micro-controllers, DSPs, other accelerators or supporting hardware into a single chip.
02.	Performance benefit is more in a System in Package.	Performance benefit is less in a System on Chip as compared to SiP.
03.	Product volume is more than SoC.	Product volume is less than SiP.
04.	It includes logic, memory and possibly analog or RF functions.	It includes a computer engine micro processor core, digital signal processor core or graphics core memory and logic on a single chip.
05.	Performance (Clock speed) is less than that of SoC.	Performance (Clock speed) is higher than that of SiP.
06.	SiP takes less time to market it.	SoC takes more time time to market it.
07.	System design flexibility of SiP is very high.	System design flexibility of SoC is very low.
08.	SiP has good IP availability chances.	SoC has not so good IP availability chances.
09.	Passive device integration is medium.	Passive device integration is small.
10.	It typically used inside smart phones, digital music player etc.	It typically used in mobile computing such as tablets, smartphones, smartwatches and netbooks as well as embedded systems.